Optical Inspection Equipment - Company Ranking(7 companyies in total)
Last Updated： Aggregation Period:Aug 06, 2025〜Sep 02, 2025
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Please refer to the catalog. | 【Defective Parts】 Out of stock, parts standing (vertical/horizontal), polarity, rotation, misalignment, marking (OCV) Incorrect parts, front and back reversal, surplus parts, foreign object inspection, floating defects, 【Solder Inspection】 Solder fillet height, solder volume %, excess solder, insufficient solder Bridging, through-hole, lead floating, golden finger damage, Dirt, debris | ||
| Imaging Method: Stop and Go Top Camera: 25MP High-Speed Camera Imaging Resolution: 2.5μm; 3.45μm; 5.5μm Lighting: Multi-Phase True Color LED 3D Technology: Quad Digital Fringe Projector Maximum 3D Range: 20 mm Inspection Performance Imaging Speed: Up to 7.7 cm²/second Motion Table & Control X-Axis Control: Ball Screw + AC Servo with Motion Controller Y-Axis Control: Ball Screw + AC Servo with Motion Controller Z-Axis Control: Ball Screw + AC Servo with Motion Controller XY Axis Resolution: 1μm with optional Linear Encoder Board Handling Maximum PCB Size: 400 x 330 mm PCB Thickness: 0.6 to 5 mm Maximum PCB Weight: 3 kg Top Clearance: 25 mm Bottom Clearance: 40 mm Edge Clearance: 3 mm. Option: 5 mm Conveyor: 880 to 920 mm Dimensions WxDxH: 1000 x 1460 x 1650 mm | Stop-and-Go 3D AOI can inspect wire bonds, die bonds, SMD, bumps, and solder joints. Inspection Functions Component: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component Solder: Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/Contamination | ||
| For details, please contact us. | Wire Bonding Evaluation Ball Bond Diameter Stitch Width Short No Touching of Bond of Pad Edge Bump/Ball/Stitch Lifting Ball Smearing Cannot Touch Pad Edge Neck Broken Abnormal Ball Shape Chip Evaluation Die Shift Die Rotation Missing Die Insufficient Epoxy | ||
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ティアールアイ ジャパン 日本支社
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- Featured Products
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AOI (Automated Optical Inspection Device) 'TR7700Q SII Series'
- overview
- Please refer to the catalog.
- Application/Performance example
- 【Defective Parts】 Out of stock, parts standing (vertical/horizontal), polarity, rotation, misalignment, marking (OCV) Incorrect parts, front and back reversal, surplus parts, foreign object inspection, floating defects, 【Solder Inspection】 Solder fillet height, solder volume %, excess solder, insufficient solder Bridging, through-hole, lead floating, golden finger damage, Dirt, debris
AOI (Automated Optical Inspection Device) 'TR7700QM SII'
- overview
- Imaging Method: Stop and Go Top Camera: 25MP High-Speed Camera Imaging Resolution: 2.5μm; 3.45μm; 5.5μm Lighting: Multi-Phase True Color LED 3D Technology: Quad Digital Fringe Projector Maximum 3D Range: 20 mm Inspection Performance Imaging Speed: Up to 7.7 cm²/second Motion Table & Control X-Axis Control: Ball Screw + AC Servo with Motion Controller Y-Axis Control: Ball Screw + AC Servo with Motion Controller Z-Axis Control: Ball Screw + AC Servo with Motion Controller XY Axis Resolution: 1μm with optional Linear Encoder Board Handling Maximum PCB Size: 400 x 330 mm PCB Thickness: 0.6 to 5 mm Maximum PCB Weight: 3 kg Top Clearance: 25 mm Bottom Clearance: 40 mm Edge Clearance: 3 mm. Option: 5 mm Conveyor: 880 to 920 mm Dimensions WxDxH: 1000 x 1460 x 1650 mm
- Application/Performance example
- Stop-and-Go 3D AOI can inspect wire bonds, die bonds, SMD, bumps, and solder joints. Inspection Functions Component: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component Solder: Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/Contamination
AOI for semiconductor devices 'TR7700QE-S'
- overview
- For details, please contact us.
- Application/Performance example
- Wire Bonding Evaluation Ball Bond Diameter Stitch Width Short No Touching of Bond of Pad Edge Bump/Ball/Stitch Lifting Ball Smearing Cannot Touch Pad Edge Neck Broken Abnormal Ball Shape Chip Evaluation Die Shift Die Rotation Missing Die Insufficient Epoxy
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ティアールアイ ジャパン 日本支社
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